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Micro/Nano Fabrication Laboratory

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Equipment List, PRISM Micro/Nano Fabrication Lab, Princeton University

Classification # / Make / Model Equipment Use

Thermal Process

1. Thermco / Brute IV Horizontal tube furnaces Steam and dry silicon oxidation and annealing
Tube 1 Clean metal anneal (Ti or Al)
Tube 2 Anealing and oxidation
Tube 3 Clean Si anneal and oxidation
2. AG Associates / Mini-Pulse Rapid thermal anealer Ultra fast heating for annealing metal contacts (III-V compounds)
3. Modular Process Technology Corp. Silicon rapid thermal anealer Ultra fast heating for annealing metal contacts (silicon)
4. Tystar Tytan Stack Four Horizontal tube furnaces LPCVD Tube 1 Oxidation of clean silicon (No metal)
Tube 2 Poly-Silicon (No metal)
Tube 3 Thermal nitride (No metal)
Tube 4 TEOS low temp oxide (No metal)
5. CVD 2 Stack Furnace Horizontal tube furnaces Tube 1 Wet oxidation
Tube 2 sealed ampoule diffusion

Metals/Dielectrics

6. Denton / DV-502A Electron beam evaporator n-type and thin film deposition
7. Edwards / E306A  Thermal evaporator n-type and thin film deposition
8. Innovative Systems Electron beam evaporator n-type and thin film deposition Ti, Cr, Ni, Au, Ge, Pt
9. AJA Dielectric Sputterer Sputter coater Sputter dielectric films Si, SiO2, SiNx
10. Angstrom Sputterer Sputter coater Sputter Al, Al+1%Si, Au, Au+1%Sb, Mo, Ti, Pt, Ni, W, Cr
11. Cambridge NanoTech / Savannah 100 Atomic layer deposition Deposition of Al2O3

Dry Etch

12. Plasma-Therm / 790 Reactive ion etching and plasma enhanced chemical vapor deposition Etching and deposition of thin films
SiNx, SiO2, III-V, silicon, quartz
RIE gases H2, CH4, CF4, O2, SF6, CHF3, Ar
PECVD gases NH3, SiH4, N2O, N2, CF4, Ar, He
13. Plasma-Therm / 720 SLR Reactive ion etching Etching silicon, polysilicon, SiO2
Etch gases BCl3, Cl2, Ar, O2, CCl2F2, CF4, H2
14. Astex ECR Electron cyclotron resonance etcher Super dense plasma etching of III-V’s
Etch gases BCl3, Cl2, Ar, O2, SF6, CF4
15. TePla / M4L
Reactive ion etching Surface treatment and cleaning, photoresist stripping, etching of plastics
Etch gases CF4, O2, Ar
16. Technics / Micro 800 Reactive ion etching Etching of thin films, SiNx, SiO2, photoresist
Etch gases O2, CF4+5%O2

Measurement

17. KLA-Tencor / P-15
Surface profiler 2D and 3D step profiles, stress measurement
18. Dektak / IIa Surface profiler Thin film step measurements
19. NanoSpec / AFT Interferometer measurement Thin transparent film thickness measurement
20. BioRad / ECV ECV profiler Dopant profiling
21. Gaertner L3W16 Ellipsometer Variable angle, three wavelength ellipsometer

22. Olympus / MX40 .7-D700

Microscope w/ digital camera High resolution reflected light microscope, brightfield, darkfield, Nomarski (DIC)
23. Olympus / MX51 Microscope High resolution reflected light microscope, brightfield and darkfield
24. Nikon / Optiphot Microscope High resolution reflected light microscope for sample inspection
25. Meiji / ML-BD-MET Microscope High resolution reflected and transmitted light microscope for sample inspection
26. Leitz / SM LUX-HL Microscope High resolution reflected and transmitted light microscope for sample inspection
27. Explorer / E 11140 Analytical balance Digital balance with internal calibration, 110g maximum.
28. Mitutoyo / 543-523-1 Digital indicator Thickness measurement up to 30mm
29. Mitutoyo / 543-256B Digital indicator Thickness measurement up to 12mm, low force

Lithography

30. Heidelberg / DWL66

Laser writer Writing masks up to 6".
Front and back side alignment, metrology.
31. Karl Suss / MJB3 3" Mask aligner 3" sample, 4" mask, proximity or contact aligner. Infrared back alignment. Tolerance: approx. 1 micron
32. Karl Suss / MA6 6" Mask aligner Up to 6" samples, 2" - 7" masks, proximity or contact aligner
33. Headway / Spinners 6" Spin coater Spin coater for application of liquid thin films up to 4" diameter
34. Headway / Spinners 14" Spin coater Spin coater for application of liquid thin films up to 8" diameter
35. Brewer Science/CEE 1100 6" Vacuum hot plate Contact, proximity, and vacuum bake. N2 atmosphere
36. Electronic Micro Systems/ 1000-1 6" Vacuum hot plate Contact and vacuum bake
37. Nanonex / NX2000-4
4" Nanoimprinter Nanoimprint lithography tool. Thermal & UV-curable imprint, optical alignment. Substrates up to 4" diameter.
38. Nanonex/ NX-S-4 4" Separator Separator for 4" imprinted wafers
39. Yield Engineering Systems/YES-310TA Image Reversal Oven Vacuum baking, image reversal lithography, vapor prime process
40. Raith / e_LiNE 4" electron beam writer Writing samples and masks up to 4"

Miscellaneous

41. UVOCS / T10X19 OES UV / ozone cleaner Ultraviolet / ozone removal of organic substances
42. Varian / ML91 Sealed ampule diffusion Glass ampoule sealing station for diffusion
43. Buehler / Minimet 1000 Polisher, grinder Grinder, polisher for small wafers
44. South Bay Technologies 8" Polishing - Lapping Wheel Grinder, polisher for small wafers
45. SemiTool Spin-Dryers Batch rinse and dry Spin rinser dryer for 4" round wafers. Metal area
46. SemiTool Spin-Dryers Batch rinse and dry Spin rinser dryer for 4" round wafers. Pre-furnace clean, (No metals)
47. VWR / 1410 Vacuum / N2 oven Drying, curing, outgassing, annealing
48. RCA Wet Hood Various wet processing RCA clean, piranha clean, Si3N4 etch
49. CPD - 030 Critical Point Dryer Drying samples
Packaging 50. Kulicke & Soffa / 982-6 Wafer dicing saw Precision wafer dicing
51. Research Devices / M8A Flip-chip bonder Programmable precision aligner and placement
52. West Bond / 7400A Wedge bonder Ultrasonic and heated gold wire applicator, Au and Al
53. Loomis / 789 Scribing tool Scribing wafers
54. West Bond / 7700B Ball bonder Ultrasonic and heated gold wire applicator, Au only
Troubleshooting 55. Varian / 979 Helium leak detector Vacuum leak testing applications
56. Met One / GT-521 Particle counter Hand-held laser particle counter

 

 

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Princeton University, Princeton, NJ 08544 USA
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