Technics/Micro 800 RIE Manufacturer: Technics/Micro Operating Instructions

General Information and Usage:
Micro 800 RIE is a parallel plate reactive ion etcher equipped with 3 gases: O₂, and CF₄+5%O₂, and SF₆. The etcher is designated for the photoresist ashing, surface cleaning, etching polymer substrates, and for etching metals and other materials that react with Fluorine plasmas. There is no throttle valve to control the pressure and the gas flow is adjusted by a needle valve. As a result of the parallel plate design, the etch rate is higher than in theTePla M4L etcher. However, the substrate size is limited due to the gas feed in the center of the bottom electrode. No authorization required for polymer etching, but the staff must be consulted if other types of materials are etched, especially if SF6 is used.

Contact Information for Users of PRISM Micro/Nano Fabrication Lab:
For additional information regarding the Technics/Micro RIE, please contact The PRISM Staff at: PRISM-CLEANRM-OPS@princeton.edu

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