Technics/Micro 800 RIE Manufacturer: Technics/Micro Operating Instructions

General Information and Usage:
Micro 800 RIE is a parallel plate reactive ion etcher equipped with two gases: O₂ and CF₄+5%O₂. The etcher is designated for the photoresist ashing, surface cleaning, and etching of plastic substrates. There is no throttle valve to control the pressure and the gas flow is adjusted by a needle valve. As a result of the parallel plate design, the etch rate is higher than in TePla M4L etcher. However, the substrate size is limited due to the gas feed in the center of the bottom electrode. No authorization required. Follow the operating instructions.

Contact Information for Users of PRISM Micro/Nano Fabrication Lab:
For additional information regarding the Technics/Micro RIE, please contact The PRISM Staff at: PRISM-CLEANRM-OPS@princeton.edu

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