Image Reversal Oven  Manufacturer: Yield Engineering System Operating Instructions Authorized Users

General Information and Usage:
Yield Engineering Systems has combined the most effective application methods of vacuum baking and vapor priming. By utilizing the same chamber, the system creates a heated vacuum environment for dehydration and vapor priming, greatly reducing the risks of rehydration or contamination of the wafers.
Oven can be used for vacuum baking, image reversal lithography and applying adhesion promoter (HMDS).
In an image reversal process, exposed resist undergoes a vacuum/ammonia diffusion bake. The amine vapor inhibits the photochemically active compound, so that following the bake, flood exposure only affect the previously unexposed resist. After development, the image is reversed from original mask. The combination of the initial pattern exposure and the flood exposure after Image Reversal allow precise control of the wall angle of the developed photoresist.
During vapor-priming the wafers are bathed in HMDS vapors that allows the application of HMDS in a monolayer. Vacuum Bake/Vapor Prime processing provides improved line uniformity after etch due to the uniformity of the resist adhesion. Wafers processed using this method can be stored longer without deterioration of the adhesion bond.

Contact Information for Users of PRISM Micro/Nano Fabrication Lab:
For additional information regarding the Image Reversal Oven, please contact the PRISM Staff at: PRISM-CLEANRM-OPS@princeton.edu

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