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General Information and Usage:
Angstrom metal sputterer is a three-source sputterer with a load lock. It has two DC and one RF power supplies with a maximum output power of 2.5 kW and 600 W, respectively. Co-deposition from two different targets is also possible and can be accomplished by running either one of the DC and the RF power supplies. The system is pumped by a cryo pump. At present, argon is the only carrier gas. There are three thickness monitors installed, one for each target, plus an additional monitor for total thickness. The available targets are: Al, Al+1%Si, Au, Au+1%Sb Cr,Mo, Ni, Pt, Ti, and W.
Recipes:
Sputter Data
Contact Information for Users of PRISM Micro/Nano Fabrication Lab:
For additional information regarding the Angstrom Metal Sputterer, please contact the PRISM Staff at: PRISM-CLEANRM-OPS@princeton.edu
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