TePla M4L Etcher Manufacturer: TePla America Operating Instructions Authorized Users

General Information and Usage:
The TePla M4L plasma etcher is a batch-mode plasma system for etch, strip, clean, and surface treatment. The etcher is designated for photoresist ashing, surface cleaning, and surface treatment and etching of plastic substrates. The following gases are installed: O₂, Ar, and CF₄. The flow rate for each gas is set by a mass-flow controller (MFC), and the pressure is controlled separately by a throttle valve between the chamber and the pump. The maximum RF power is 600 W, but use caution when etching plastic substrates. The etcher is equipped with a thermocouple to monitor the temperature. All system functions are controlled from the computer running on Windows NT. The program has both manual and automatic modes. Users should program frequently used sequences and run them in an automatic mode.

Contact Information for Users of PRISM Micro/Nano Fabrication Lab:
For additional information regarding the M4L Etcher, please contact the PRISM Staff at: PRISM-CLEANRM-OPS@princeton.edu

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