South Bay Technologies 8" Polishing - Lapping Wheel Manufacturer: South Bay Technologies Authorized Users Operating Instructions

General Information and Usage:
The polishing-lapping wheel can be used for the thinning, or mirror polishing required for different applications, e.g., polishing of small wafers (Si, GaAs, …). It has two attachments, one holds pieces up to 35 mm across, and the other holds pieces up to 50 mm across. To remove material, the specimen is placed on a variably loaded arm that moves in a circular geometric pattern bounded by a stationary polishing bowl. Material removal is done by a grinding disc, or by a combination of abrasive/lapping/polishing cloth. The user can control the speed of the rotating table from 8 to 600 rpm, and the force is the weight of the chuck (this can be increased with an additional weight).  A variety of grinding disks, abrasive papers, polishing powders and suspensions, lapping films, and polishing cloths are available.

Contact Information for Users of PRISM Micro/Nano Fabrication Lab:
For additional information regarding the South Bay Technologies 8" Polishing - Lapping Wheel, please contact the PRISM Staff at: PRISM-CLEANRM-OPS@princeton.edu

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