M8A Flip Chip Bonder Manufacturer: Research Devices Operating Instructions Authorized Users

General Information and Usage:

The Flip Chip Bonder is designed to align (X, Y, Z, Roll, & Pitch) two chips (and their respective contact "bumps") for contact and bonding via the application of heat (up to 400C) and pressure (up to 40 kg).

Contact Information for Users of PRISM Micro/Nano Fabrication Lab:
For additional information regarding the Research Devices M8A Flip Chip Bonder, please contact the PRISM Staff at: PRISM-CLEANRM-OPS@princeton.edu

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