K&S 982-6 Wafer Dicing Saw Manufacturer: Kulicke & Soffa Operating Instructions Authorized Users

General Information and Usage:
The K&S Wafer Dicing Saw is for precision cutting of glass or semiconductor materials. The saw can cut items of 150 mm diameter or less, and thicknesses of 2 mm or less. Due to the expense and complexity of the saw, research groups are limited in the number of people who can become Users of the wafer saw. Therefore, all Users are required to make themselves available to nonUsers who need to make use of the machine. For training purposes, all Users are Superusers.

Contact Information for Users of PRISM Micro/Nano Fabrication Lab:
For additional information regarding the K&S 982-6 Wafer Dicing Saw, please contact the PRISM Staff at: PRISM-CLEANRM-OPS@princeton.edu.

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