DWL66 Laser Writer Manufacturer: Heidelberg Instruments Operating Instructions Authorized Users Mask design rules for DWL66 AutoCad LT Quick Start Guide L-Edit Pro Quick Start Guide

General Information and Usage:
DWL66 is a laser writer used for writing patterns into photoresist-coated surfaces. The system is equipped with a 442-nm HeCd laser and two exchangeable writeheads. The 4-mm writehead has a focal depth of 1.8 mm and a minimum feature size of 800 nm. It should be used for high-resolution writing of thin photoresists (~ 500 nm thick). The 20-mm writehead has a focal depth of ~ 50 mm and a minimum feature size of 4 mm. It is meant for low-resolution writing and/or thick photoresits. It takes about an order of magnitude less time to write the pattern with the 20-mm writehead if compared to writing the same pattern with the 4-mm writehead. A number of vacuum chucks is available for the front and backside writing on substrates ranging from ~ 1 inch square to 6 x 6 inch square. The metrology allows to measure the patterns.

Before writing a mask, the user needs to design the pattern. The “Mask Design Computer” equipped with AutoCAD LT and L-Edit Pro is located in the J-wing atrium of the E-Quad. The DWL66 laser writer can handle the following files: DXF, HPGL, Gerber, GDSII, and CIF. Save the mask design on a floppy, USB memory stick, or a CD, and bring it to the clean room. The file will be converted into LIC files that are outputted into the DWL system. The conversion program is part of the DWL66 system and runs in Linux operating system. The laser writer itself runs in OS-9 operating system.Both the OS-9 computer and the conversion program are controlled via Windows-XP platform.

For mask writing, the users are advised to use the low-reflective-Cr plates from Nanofilm coated with 530 nm thick AZ1518 photoresist.

Contact Information for Users of PRISM Micro/Nano Fabrication Lab:
For additional information regarding the DWL66 Laser Writer, please contact the PRISM Staff at: PRISM-CLEANRM-OPS@princeton.edu

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