CLEANROOM ACCESS FORM FOR FY2009/2010
Material
Safety Data Sheets
Product:
|
Company: |
Chemical formula: |
10% Oxygen
in Halo 14
|
Praxair
|
O2 + CF4 |
Acetic
Acid
|
J.T. Baker
|
CH3COOH |
Acetone
|
J.T. Baker
|
(CH3)2CO |
Aluminum, metal
|
Pure Tech
|
Al |
Ammonia, gas
|
Praxair
|
NH3 |
Ammonium
Fluoride
|
J.T. Baker
|
NH4F |
Ammonium
Hydroxide
|
J.T. Baker
|
NH4OH |
Argon, compressed gas
|
MG Messer |
Ar |
ALEG-310,
Ash residue remover
|
J.T. Baker
|
|
| AZ
1518 Photoresist |
Clariant Corporation |
|
| AZ
300 MIF Developer |
Clariant Corporation |
|
| AZ
300T Photoresist Stripper |
Hoechst Celanese |
|
| AZ
312 MIF Developer |
Clariant Corporation |
|
| AZ 400K
Developer |
Clariant Corporation |
|
| AZ 421K
Developer |
Clariant Corporation |
|
| AZ
422 MIF Developer |
Clariant Corporation |
|
| AZ
5206-E Photoresist |
Clariant Corporation |
|
| AZ
5214-E IR Photoresist |
Clariant Corporation |
|
| AZ
7905 MIF Photoresist |
Clariant Corporation |
|
| AZ EBR
Solvent |
Clariant Corporation |
|
| AZ
nLOF 2020 Photoresist |
Clariant Corporation |
|
| AZ
P4110 Photoresist |
Clariant Corporation |
|
| AZ
P4210 Photoresist |
Clariant Corporation |
|
| AZ
P4330-RS Photoresist |
Clariant Corporation |
|
| AZ
P4620 Photoresist |
Clariant Corporation |
|
| AZ R2
Developer |
Clariant Corporation |
|
| AZ Thinner |
Hoechst Celanese |
|
PRS-1000,
Photoresist stripper
|
J.T. Baker
|
|
PRS-3000,
Resist stripper
|
J.T. Baker
|
|
| Buehler
Mastermet |
Buehler |
Polishing compound |
Buffered
oxide etch w/surfactant
|
J.T. Baker
|
HF |
Boron
Trichloride, gas
|
Praxair
|
BCl3 |
Borosilicafilm
|
Emulsitone Co.
|
CO=5x1020 |
| Bright Electroless Gold |
Transene Co., Inc |
|
Bromine
|
J.T. Baker
|
Br2 |
Calcium Gluconate
|
Pharmascience
|
|
Carbon Dioxide,
gas
|
MG Messer
|
CO2 |
Chlorine, gas
|
Praxair
|
Cl2 |
Chlorobenzene
|
J.T. Baker
|
C6H5Cl |
Chrome, metal
|
Pure Tech
|
Cr |
Citric
Acid, Anhydrous, granular
|
Fisher
|
|
CR-17, Chromium
etchant
|
Cyantek
|
|
CR-7, Chromium etchant
|
Cyantek
|
|
Ethylene
Glycol
|
J.T. Baker
|
CH2OHCH2OH |
Gallium Indium, Eutectic
|
Johnson Matthey
|
GaIn |
Germanium, pieces
|
Pure Tech
|
Ge |
Gold, Shot
|
Williams Advanced Materials
|
Au |
Gold
Zinc, Wire
|
Williams Advanced Materials
|
AuZn |
Halocarbon
12, compressed gas
|
MG Messer
|
CCl2F2 |
Halocarbon
14, compressed gas
|
Praxair
|
CF4 |
| Halocarbon 23,
gas |
Praxair |
CHF3 |
Helium, compressed
gas
|
MG Messer
|
He |
| Helium,
cryogenic liquid |
MG Messer |
He |
Hydrochloric
Acid
|
J.T. Baker
|
HCl |
Hydrofluoric
Acid
|
J.T. Baker
|
HF |
Hydrogen
Chloride, gas
|
Praxair
|
HCl |
Indium, metal
|
Indium Corporation
|
In |
| Iodine |
J.T. Baker |
|
Isopropanol
|
J.T. Baker
|
(Ch3)2 CHOH |
Methane, compressed
gas
|
MG Messer
|
CH4 |
Methanol
|
J.T. Baker
|
CH3OH |
Methyl
ethyl ketone
|
Fisher
|
|
Microposit
PR Stripper
|
MicroChem Corp.
|
|
Nickel, metal
|
Pure Tech
|
Ni |
Nitric Acid
|
J.T. Baker
|
HNO3 |
Nitrogen,
compressed gas
|
MG Messer
|
N2 |
Nitrous Oxide,
gas
|
MG Messer
|
N2O |
Oxygen, compressed
gas
|
MG Messer
|
O2 |
Palladium,
granules
|
Alfa Aesar
|
Pd |
Phosphoric
Acid
|
J.T. Baker
|
H3PO4 |
Phosphorosilica
film
|
Emulsitone Co.
|
5 x 1020 |
| Phosphorosilica
film |
Emulsitone Co. |
3 x 1020 |
Platinum, metal
|
Williams Advanced Materials
|
Pt |
PMMA
Photoresist Remover
|
MicroChem Corp.
|
|
| Poly(3,4-Ethylened.)/Poly(Styrenesulf.) |
Sigma-Aldrich |
C28H28010S4 |
Potassium hydroxide
|
Fisher
|
KOH |
| Potassium Iodide |
J.T. Baker
|
|
Probimide
284
|
Hubbard-Hall
|
|
Probimide
285
|
Hubbard-Hall
|
|
Probimide
Adhedsion Promoter
|
Hubbard-Hall
|
|
| Rhodium |
Pure-Tech |
|
Rhodium,
pellets
|
Alfa Aesar
|
Rh |
| RTM Solution D |
Transene Co., Inc |
|
Silane, compressed
gas
|
Praxair
|
SiH4 |
Silicon
Dioxide, pellets
|
Williams Advanced Materials
|
SiO2 |
Silicon
Monoxide, pellets
|
Super Conductor Materials
|
SiO |
Silicon
Nitride, pellets
|
Williams Advanced Materials
|
Si3N4 |
Silicon, pieces
|
Williams Advanced Materials
|
Si |
Silver, metal
|
Williams Advanced Materials
|
Ag |
Sodium
Hydroxide
|
Fisher
|
NaOH |
SU-8 Developer
|
MicroChem Corp.
|
|
SU-8
Photoresist
|
MicroChem Corp.
|
|
Sulfuric
Acid
|
J.T. Baker
|
H2SO4 |
| Sulfur Hexafluoride,
gas |
Praxair |
SF6 |
TetraethylOrthosilicate
(TEOS)
|
J.T. Baker
|
(C2H5O)4Si |
Tergitol
NP-10
|
J.T. Baker
|
(C2H4O)nC15H24O |
Titanium, metal
|
Pure Tech
|
Ti |
Titanium
Oxide
|
Super Conductor Materials
|
TiO2 |
Toluene
|
J.T. Baker
|
C6H5CH3 |
Trichloroethylene
(TCE)
|
J.T. Baker
|
C2HCl3 |
| Trimethylaluminum
(TMA) |
Aldrich Chemical |
C3H9Al |
| TRIS-(8-Hydroxyquinoline) Aluminum |
Sigma-Aldrich |
C27H18A1N303 |
| ZDMAC remover |
Zeon Chemicals L.P. |
|
| ZED-N50 developer |
Zeon Chemicals L.P. |
|
| ZEP A thinner |
Zeon Chemicals L.P. |
|
| ZEP520A e-beam resist |
Nippon Zeon Co. Ltd |
|
Zinc, pellets
|
Williams Advanced Materials
|
Zn |
Zinc Arsenide
|
Cerac Inc.
|
Zn3As2 |
|
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